By Andy Heong
Huawei and Telekom Research & Development Sdn Bhd (TM R&D) have teamed-up to co-develop the next-generation access technologies for both fixed-line and wireless connectivity in Malaysia.
Towards this end, both companies have signed a memorandum of understanding (MoU).
TM R&D is wholly-owned by Telekom Malaysia Bhd, while Huawei is a leading global information and communications technology solutions provider. In a joint-statement, the companies said they would research the most suitable, customised copper access and 4G solutions for Malaysia’s fixed
and broadband landscapes.
Both parties will also share research facilities and encourage the transfer of knowledge, as well as establish a joint lab within the TM Innovation Centre, in Cyberjaya, within the Multimedia Super Corridor (MSC) of Malaysia.
TM R&D chief executive officer Gopi Kurup said the collaboration reflects its commitment to evolve the nation’s High Speed Broadband, which has had become a global reference point of future-oriented smart networks.
“We believe the next generation access technologies will further enhance our broadband user experience and TM’s wireless coverage in the long run,” he added.
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